Power sequence Size C Date: NB Size Custom Date: Does not impact AUB functionality. Monday, September 03, Sheet 1 Engineer: It can be programmable by EC fireware. Na nodze kbc mam 3. Wednesday, September 05, 5 4 3 2 1 Title:

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The smaller Zenfone 3 Max variant has on screen buttons and misses on Tri-tech AF and other swanky camera technology present in the higher-end variant. Add CMOS crack protection circuit.

Normal Operation Default – 0: Monday, September 03, 1 Engineer: Na przycisku jest 3V. Please enter your name here.

Remove testing 2nd CIR design. Add ALC on Page 36 5. With EMI’s confirmation, remove reserved common choke circuit. C if SS used. This signal should be only sf3 low through an external pull-down in manufacturing or debug environments ONLY.

LAN chip version change. Intel LAN 2 8.


NB Size Custom Date: Default internal PU 20K. For Xtal measurement Not connected to device.

Project Name Thursday, April 15, 1 1. It can be programmable by EC fireware.

ASUS M50S_ X55S rev_百度文库

John Hung Rev 1. USB droop test fail. Project Name Custom Date: Reserver 10K PU for power saving purpose. Add Display Port on Page 47 A more power efficient chipset, however, will offset the difference to an extent. Can be connected to GND directly: Aus jack detection modification. X55 need two pwer LEDs. NB6 Size C Date: Na nodze xf3 mam 3. Add Audio Circuit on Page 37 6.

Wednesday, September 05, 5 4 3 2 1 Title: Default internal pull up.

Чехлы для ASUS ZenFone 4 Max (ZC520KL)

Rumored Specs and Details. Internal PU to suspend plane. You have entered an incorrect email address! Monday, September 03, 2 1 Engineer: VTAP Assumed as 1.